Upgraded QUICK 2008D+ lead-free desoldering station 750W hot air gun for Mobile Phone LCD display motherboard BGA IC soldering repair
whose no-load speed can reach 200rpm
Temperature Stability: ±2℃/Without air flow and no load
Adjustable constant temperature of 350 ℃ -450 ℃
1x Android motherboard mold
5MP USB 3.0 CMOS Digital Industrial Camera Microscope Eyepiece Phone USB Charging Upgraded QUICK 2008D+ lead-free desoldering5MP Industrial Digital Camera, USB 3. 0 Image Output, CMOS Sensor, 60FPS Electronic Digital Eyepiece Microscope Accessories. Specification: Imaging Sensor: Sony IMX335, 1 2. 8 inches Color CMOS Image Sensor Scan Patterns: Scan Line By Line Maximum Resolution: 5. 0M, 2592 x 1944(5,038,848 Pixels) Sensor Optical Format: 1 2. 5" (5. 70mm(H) x 4. 28mm(V), Diagona 7. 13mm) Pixel Size: 2. 2m x 2. 2m ADC: 12 bit, 8 Bit R. G. B to PC SNR: Signal to noise 35dB