JTX T4 MAX Phone CPU/EMMC/RAM Glue Removal Reballing Platform Option:T4 MAX reballing set The mobile phone can be

Name: JTX T4 MAX Phone CPU/EMMC/RAM Glue Removal Reballing Platform Option:T4 MAX reballing set The mobile phone can be
Brand: iwinv1.com
SKU: 98383325650
Price: 25.09 USD
Availability: InStock
Rating: 4.8982 (9 reviews)

Studio No. 98383325650

Seal price

USD25.09 USD55.09

4.9

Pay in 4 interest-free payments of $6.27 Learn more

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USA

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Ships within 48 hours · Estimated delivery Sep 16 - Sep 21

Atelier notes

Description

The mobile phone can be accurately aligned with the mold

Specification:Model: Sugon 8650 3M Hot Air Gun (professional version)

5V batteries

Professional iPhone Battery Replacement Kit - i2C KC02S battery health programmer resets 100% battery capacity and 0 cycle with one-click

Very long endurance

JTX T4 MAX Phone CPU/EMMC/RAM Glue Removal Reballing Platform Option:T4 MAX reballing set The mobile phone can beJTXTOOLS T4MAX Glue Removal & Reballing Platform with 17 precision stencils for efficient glue removal and precise tin planting on CPU, EMMC, and RAM chips. Supporting 102 chip models across Apple iPhone, Android, Exynos, Qualcomm, HiSilicon, and Dimensity processors. A powerful magnetic force firmly secures the chip, automatically clamping and aligning it for precise chip placement. It is an essential tool for mobile phone repair technicians

Exchange/Return Notes